Espoo, Finland

Daniele Chiappe

USPTO Granted Patents = 6 

Average Co-Inventor Count = 8.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2023-2025

where 'Filed Patents' based on already Granted Patents

6 patents (USPTO):

Title: The Innovative Contributions of Daniele Chiappe

Introduction

Daniele Chiappe is a notable inventor based in Espoo, Finland. He has made significant contributions to the field of material science, particularly in the area of vapor deposition technologies. With a total of five patents to his name, Chiappe's work has advanced the methods of selectively depositing materials, which are crucial for various applications in electronics and materials engineering.

Latest Patents

Chiappe's latest patents include innovative methods for the selective deposition of materials comprising silicon and oxygen using plasma. These methods involve a cyclic deposition process that allows for the precise application of materials on substrates. The process includes providing a substrate into a reaction chamber, introducing a metal or metalloid catalyst in vapor phase, and utilizing a silicon precursor that comprises an alkoxy silane compound. Additionally, a plasma is generated within the chamber to create reactive species that facilitate the formation of silicon-oxygen materials on the substrate's surface. Another significant patent focuses on methods for cleaning surfaces, specifically targeting substrates with dielectric and metal surfaces. These methods utilize a cleaning agent introduced into the reaction chamber to enhance the cleaning process.

Career Highlights

Daniele Chiappe has established a successful career at Asm IP Holding B.V., where he continues to innovate and develop new technologies. His expertise in vapor deposition and surface cleaning methods has positioned him as a key player in the field. His contributions have not only advanced scientific understanding but have also led to practical applications in various industries.

Collaborations

Chiappe has collaborated with several talented individuals, including Eva E Tois and Marko J Tuominen. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Daniele Chiappe's work exemplifies the spirit of innovation in material science. His patents and career achievements reflect a commitment to advancing technology and improving processes in the industry. Through his contributions, Chiappe continues to influence the future of material deposition and surface treatment methods.

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