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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Daniel R Trojan

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This inventor holds 18 USPTO granted patents and 8 published patent applications and 1 EPO patent, primarily in Wafer Processing. Top assignees: Axus Technology LLC, Speedfam-Ipec Corporation, Applied Materials, Inc.. Active years: 1999-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel R Trojan. Retrieved from https://idiyas.com/inventor/daniel-r-trojan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 84(Granted Patents)


Location History:

  • Phoenix, AZ (US) (1999 - 2022)
  • Chandler, AZ (US) (2023 - 2024)

Company Filing History:

goldMedal10 out of 10 
 
Axus Technology LLC
 patents
silverMedal3 out of 151 
 
Speedfam-Ipec Corporation
 patents
bronzeMedal1 out of 14,502 
 
Applied Materials, Inc.
 patents
4. 1 out of 316 
 
Asm America, Inc.
 patents
5. 1 out of 1 
 
Axus Technologi, LLC
 patent
6. 1 out of 8 
 
Obsidian, Inc.
 patents
7. 1 out of 834,601 
Other
 patents

Years Active: 1999-2026

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Areas of Expertise:
Wafer Processing
Chemical Mechanical Planarization
Substrate Carrier
Polishing Components
Surface Grinding
Wafer Cleaning
Process Monitoring
Temperature Control
Atmospheric Plasma
Slip Detection
Containment System
Gimbal System
18 patents (USPTO):Explore Patents
1. 12558757 - Planarized membrane and methods for substrate processing systems (2026-02-24),
2. 12377520 - Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing (2025-08-05),
3. 12217979 - Temperature controlled substrate carrier and polishing components (2025-02-04),
4. 12198935 - Atmospheric plasma in wafer processing system optimization (2025-01-14),
5. 12145236 - Containment and exhaust system for substrate polishing components (2024-11-19),
6. 12023778 - Substrate carrier head and processing system (2024-07-02),
7. 11904431 - Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing (2024-02-20),
8. 11685012 - Planarized membrane and methods for substrate processing systems (2023-06-27),
9. 11376705 - Chemical mechanical planarization carrier system (2022-07-05),
10. 10315286 - Chemical mechanical planarization carrier system (2019-06-11),
11. 9390903 - Method and apparatus for wafer backgrinding and edge trimming on one machine (2016-07-12),
12. 8944887 - Apparatus and method for surface grinding and edge trimming workpieces (2015-02-03),
13. 7540799 - System for adjusting an end effector relative to a workpiece (2009-06-02),
14. 6923711 - Multizone carrier with process monitoring system for chemical-mechanical planarization tool (2005-08-02),
15. 6368183 - Wafer cleaning apparatus and associated wafer processing methods (2002-04-09),

Title: Innovations and Contributions of Daniel R Trojan

Introduction

Daniel R Trojan is a notable inventor based in Phoenix, AZ, with a remarkable portfolio of 16 patents. His work primarily focuses on advancements in chemical mechanical planarization (CMP) systems, which are crucial in the semiconductor manufacturing process. Trojan's innovative approaches have significantly enhanced the efficiency and effectiveness of wafer polishing techniques.

Latest Patents

Among his latest patents, Trojan has developed a "Method and apparatus for insitu adjustment of wafer slip detection during work piece polishing." This invention includes a CMP system that features a carrier for retaining a substrate, a platen supporting a polishing pad, and a slip sensor that generates signals indicative of the polishing pad's surface characteristics. The system is designed to calibrate a steady-state value of the signal and detect wafer slip during polishing operations, ensuring optimal performance. Another significant patent is for "Temperature controlled substrate carrier and polishing components," which introduces temperature-controlled polishing pads. This innovation utilizes an atomizing system to cool or remove heat from the polishing pad, allowing for higher removal rates during CMP processes.

Career Highlights

Throughout his career, Daniel R Trojan has made significant contributions to the field of semiconductor manufacturing. He has worked with reputable companies such as Axus Technology LLC and Speedfam-IPEC Corporation, where he has applied his expertise to develop cutting-edge technologies in wafer processing.

Collaborations

Trojan has collaborated with esteemed

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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