The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Jun. 26, 2020
Applicant:
Axus Technology, Llc, Chandler, AZ (US);
Inventors:
Daniel Ray Trojan, Chandler, AZ (US);
John Kevin Shugrue, Phoenix, AZ (US);
Assignee:
Axus Technology, LLC, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B24B 37/04 (2012.01); B24B 37/32 (2012.01); B24B 55/02 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01); H01L 21/687 (2006.01); H01L 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); B24B 37/04 (2013.01); B24B 37/32 (2013.01); B24B 55/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/68757 (2013.01); H01L 21/0475 (2013.01);
Abstract
Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP.