Pleasanton, CA, United States of America

Daniel A Carl

This inventor holds 22 USPTO granted patents, primarily in Chemical Mechanical Polishing. Top assignee: Applied Materials, Inc.. Active years: 2001-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel A Carl. Retrieved from https://idiyas.com/inventor/daniel-a-carl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 40.9

Average Co-Inventor Count = 5.8

ph-index = 11

Forward Citations = 711(Granted Patents)


Company Filing History:


Years Active: 2001-2010

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Areas of Expertise:
Trench Structure
Interconnect Structure
Chemical Mechanical Polishing
Electrochemical Processing
Planarization
Copper Fill
Atomic Layer Deposition
Electroplating
Conductive Polishing
Feature Passivation
Material Layer Deposition
Adhesion Enhancement
22 patents (USPTO):Explore Patents

Title: Innovations by Inventor Daniel A. Carl in Semiconductor Technology

Introduction

Daniel A. Carl is a prominent inventor based in Pleasanton, California, known for his significant contributions to semiconductor technology. With an impressive portfolio of 22 patents, Carl has been at the forefront of innovations that enhance the manufacturing and efficiency of electronic components.

Latest Patents

Among his latest patents are methods that focus on the formation of trench and interconnect structures. The first patent describes a method of layer formation on a substrate featuring high aspect ratio characteristics. This innovative method employs a gas mixture containing various process gases and etch species, ensuring effective material deposition on substrates while selectively removing portions of the deposited layer. This technique guarantees that the filling of these high aspect ratio features occurs in a void-free and seam-free manner. This method utilizes both physical vapor deposition (PVD) and chemical vapor deposition (CVD) techniques for layer deposition.

Similarly, his second recent patent showcases another method of forming an interconnect structure, incorporating the same technological principles and gas mixtures. This remarkable approach continues to enhance the performance and reliability of semiconductor devices.

Career Highlights

Daniel A. Carl has built a fruitful career at Applied Materials, Inc., where he researches and develops advanced manufacturing techniques for semiconductor devices. His work has been instrumental in improving the processes that allow for the creation of more efficient and reliable electronic components.

Collaborations

Throughout his career, Carl has collaborated with notable colleagues, including Liang-Yuh Chen and Ratson Morad. These partnerships have contributed to the successful development and patenting of innovative methodologies in the semiconductor field.

Conclusion

In summary, Daniel A. Carl stands out as a key innovator in the semiconductor industry. With his extensive patents and collaborations, he plays a crucial role in advancing technology that impacts the performance of electronic devices globally. His work continues to inspire future innovations in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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