The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Dec. 27, 2001
Liang-yuh Chen, Foster City, CA (US);
Yuchun Wang, San Jose, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Daniel A. Carl, Pleasanton, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Rashid Mavliev, Santa Clara, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Yuchun Wang, San Jose, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Daniel A. Carl, Pleasanton, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Rashid Mavliev, Santa Clara, CA (US);
Stan D. Tsai, Fremont, CA (US);
Applied Materials Inc., Santa Clara, CA (US);
Abstract
An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.