The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Oct. 31, 2006
Liang-yun Chen, Foster City, CA (US);
Yuchun Wang, San Jose, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Daniel A. Carl, Pleasanton, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Rashid A. Mavliev, Campbell, CA (US);
Stan D. Tsai, Fremont, CA (US);
You Wang, Cupertino, CA (US);
Jie Diao, San Jose, CA (US);
Renhe Jia, Berkeley, CA (US);
Lakshmanan Karuppiah, San Jose, CA (US);
Robert Ewald, Aptos, CA (US);
Liang-Yun Chen, Foster City, CA (US);
Yuchun Wang, San Jose, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Daniel A. Carl, Pleasanton, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Rashid A. Mavliev, Campbell, CA (US);
Stan D. Tsai, Fremont, CA (US);
You Wang, Cupertino, CA (US);
Jie Diao, San Jose, CA (US);
Renhe Jia, Berkeley, CA (US);
Lakshmanan Karuppiah, San Jose, CA (US);
Robert Ewald, Aptos, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.