The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Mar. 30, 2006
Stan D. Tsai, Fremont, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Lizhong Sun, San Jose, CA (US);
Shijian LI, San Jose, CA (US);
Feng Q. Liu, Cupertino, CA (US);
Rashid Mavliev, Campbell, CA (US);
Ratson Morad, Palo Alto, CA (US);
Daniel A. Carl, Pleasanton, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Lizhong Sun, San Jose, CA (US);
Shijian Li, San Jose, CA (US);
Feng Q. Liu, Cupertino, CA (US);
Rashid Mavliev, Campbell, CA (US);
Ratson Morad, Palo Alto, CA (US);
Daniel A. Carl, Pleasanton, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.