Dan Yang

This inventor holds 26 USPTO granted patents and 3 published patent applications and 10 EPO patents. Top assignees: The University of Hong Kong, Hong Kong Applied Science and Technology Research Institute, Versitech, Inc.. Active years: 1998-2026.

USPTO Granted Patents = 26 (Patent Applications = 3)

% Patents Active = 80.8

EPO Patents = 10 (Patent Applications = 7)

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 62(Granted Patents)

Location History:

Hong Kong, CI (2020)
Hong Kong, CN (1998 - 2023)

Company Filing History:

11 out of 371

The University of Hong Kong

patents

8 out of 610

Hong Kong Applied Science and Technology Research Institute

Morningside Ventures Limited

patents

5. 1 out of 1

Morningside Ventures Limited & Versitech Limited

patent

6. 1 out of 498

The Chinese University of Hong Kong

patents

7. 1 out of 1

Versitech Limited & Morningside Ventures Limited

patent

where one patent can have more than one assignee

Years Active: 1998-2026

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26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12624382 - Beta-lactam compounds and methods of use thereof (2026-05-12),

2. 11585819 - Bistrifilate-based fluorogenic probes for detection of superoxide anion radical (2023-02-21),

3. 10877051 - Bistrifilate-based fluorogenic probes for detection of superoxide anion radical (2020-12-29),

4. 10684294 - Diarylether-based fluorogenic probes for detection of hypochlorous acid or hydroxyl radical (2020-06-16),

5. 9651528 - Diarylamine-based fluorogenic probes for detection of peroxynitrite (2017-05-16),

6. 9642829 - Antifungal compound and uses thereof (2017-05-09),

7. 9610263 - Method of modulating membrane potential of a cell (2017-04-04),

8. 9287624 - Antenna circuit and a method of optimisation thereof (2016-03-15),

9. 9212177 - Antiviral compounds and methods of making and using thereof (2015-12-15),

10. 9162977 - Synthetic ion channels (2015-10-20),

11. 9117715 - Wafer-level device packaging (2015-08-25),

12. 9066424 - Partitioned hybrid substrate for radio frequency applications (2015-06-23),

13. 8823126 - Low cost backside illuminated CMOS image sensor package with high integration (2014-09-02),

14. 8791578 - Through-silicon via structure with patterned surface, patterned sidewall and local isolation (2014-07-29),

15. 8772930 - Increased surface area electrical contacts for microelectronic packages (2014-07-08),

Title: Dan Yang - Pioneering Inventor from Hong Kong

Introduction: Dan Yang is a renowned inventor hailing from Hong Kong, China, known for his groundbreaking contributions to various fields through his innovative creations and patents.

Latest Patents: Dan Yang's latest patents include advancements in renewable energy technology, medical devices, and artificial intelligence systems, showcasing his diverse range of expertise and interests.

Career Highlights: With a career spanning over two decades, Dan Yang has established himself as a leading figure in the world of innovation, holding numerous patents and receiving recognition for his impactful inventions.

Collaborations: Throughout his career, Dan Yang has collaborated with top research institutions, universities, and multinational companies to further develop and commercialize his inventions, fostering a culture of innovation and progress.

Conclusion: Dan Yang's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a pioneering inventor not only in Hong Kong but on a global scale.