The University of Hong Kong

Hong Kong Applied Science and Technology Research Institute Company, Limited

Versitech, Inc.

Morningside Ventures Limited

The Chinese University of Hong Kong

Versitech Limited & Morningside Ventures Limited

The University of Hong Kong & Versitech Limited

Morningside Ventures Limited & Versitech Limited

Dan Yang

Xunqing Shi

Xiang Li

Yat Kit Tsui

Pui Chung Simon Law

Tao Peng

Nai-Kei Wong

Jun Hu

Yi Tsun Richard Kao

Song He

Zhen-Ning Sun

Pui Chung Law

Kwok Yung Yuen

Shu Kin Yau

Yu Wang

Bin Xie

Yan Liu

Kwok-Yung Yuen

Man-Kin Wong

Yuxing Ren

Lakshman Perera Samaranayake

Sze Wah Sarah Wong

Fengqin Liu

Jian-Gang Shen

Xiaoyu Bai

Ying-Chun Chen

Guan-Sheng Jiao

Man-Wai Tang

Yiu-Chung Yip

Bing Shen

Yan Chen

Xiao-Qiang Yao

Tak Ki Wan

Hua-Li Wang

Jian-Hua Zhang

Chi Keung Angus Mak

Huiyan Zha

Jiangang Shen

Xingmiao Chen

Chengyong Li

Chaminda Jayampath Seneviratne

Shiwu Chen

Nai Kei Wong

Yitsun Richard Kao

Yingchun Chen

Shi-Wu Chen

Cheng-Yong Li

The invention provides fluorogenic compounds and probes that can be used as reagents for measuring, detecting and/or screening superoxide. The fluorogenic compounds of the invention can produce fluorescence colors, such as green, yellow, red, or far-red. The invention further provides fluorogenic compounds for selectively staining superoxide in the mitochondria of living cells. The invention also provides methods that can be used to measure, directly or indirectly, the presence and/or amount of superoxide in chemical samples and biological samples such as cells and tissues in living organisms, and a high-throughput screening methods for detecting or screening superoxide or compounds that can increase or decease the level of superoxide in chemical and biological samples.

Bistrifilate-based fluorogenic probes for detection of superoxide anion radical

The invention provides fluorogenic compounds and probes that can be used as reagents for measuring, detecting and/or screening superoxide. The fluorogenic compounds of the invention can produce fluorescence colors, such as green, yellow, red, or far-red. The invention further provides fluorogenic compounds for selectively staining superoxide in the mitochondria of living cells. The invention also provides methods that can be used to measure, directly or indirectly, the presence and/or amount of superoxide in chemical samples and biological samples such as cells and tissues in living organisms, and a high-throughput screening methods for detecting or screening superoxide or compounds that can increase or decrease the level of superoxide in chemical and biological samples.

Provided herein are improved fluorogenic compounds and probes that can be used as reagents for measuring, detecting and/or screening hypochlorous acid or hydroxyl radical. The fluorogenic compounds of the invention can produce fluorescence colors, such as green, yellow, red, or far-red. Also provided herein are fluorogenic compounds for selectively staining hypochlorous acid or hydroxyl radical in the mitochondria of living cells. Provided also herein are methods that can be used to measure, directly or indirectly, the presence and/or amount of hypochlorous acid or hydroxyl radical in chemical samples and biological samples such as cells and tissues in living organisms. Also provided are high-throughput screening methods for detecting or screening hypochlorous acid or hydroxyl radical or compounds that can increase or decrease the level of hypochlorous acid or hydroxyl radical in chemical and biological samples.

Diarylether-based fluorogenic probes for detection of hypochlorous acid or hydroxyl radical

Provided herein are improved fluorogenic compounds and probes that can be used as reagents for measuring, detecting and/or screening peroxynitrite. The fluorogenic compounds of the invention can produce fluorescence colors, such as green, yellow, red, or far-red. Also provided herein are fluorogenic compounds for selectively staining peroxynitrite in the mitochondria of living cells. Provided also herein are methods that can be used to measure, directly or indirectly, the presence and/or amount of peroxynitrite in chemical samples and biological samples such as cells and tissues in living organisms. Also provided are high-throughput screening methods for detecting or screening peroxynitrite or compounds that can increase or decrease the level of peroxynitrite in chemical and biological samples.

Diarylamine-based fluorogenic probes for detection of peroxynitrite

Disclosed herein is a novel antifungal compound, derivatives that are used to treat fungal infections. In a specific embodiment, the compound is a small molecule. In a specific embodiment, the compound described herein inhibits yeast to hypha transition under robust hyphal inducing conditions at lower concentration of the molecule. Also disclosed is a composition comprising the antifungal compound. In a specific embodiment, the composition is a pharmaceutical composition. Also disclosed is a method of treating and/or preventing fungal infection using the disclosed compound. The disclosed compound exhibits antifungal activity against wide range of fungal species at slightly higher concentrations. Antifungal compound disclosed herein is used as anti-biofilm agent against fungal infections.

Antifungal compound and uses thereof

Provided herein are methods of modulating membrane potential of a cell membrane using self-assembling compounds. Also provided herein are methods of regulating a natural voltage-dependent ion channel in a cell membrane using the self-assembling compounds disclosed herein. Further provided herein are methods of treating, preventing and/or managing a disease that is related to the abnormal membrane potential responses by using the self-assembling compounds disclosed herein.

Method of modulating membrane potential of a cell

An antenna circuit is having an impedance circuit which can cancel signal leakage from the input port into the isolation port of a directional coupler. The antenna circuit further comprises a second impedance circuit for optimizing power transfer from the input port to the output port of the directional coupler. Furthermore, the antenna is tunable in order to maximize the reception strength of the antenna. The antenna circuit provides at once the possibility of tuning the antenna strength, optimizing the power transmission and reducing signal jamming by cancelling signal leakage. The antenna finds use as an effective and miniature RFID antenna.

Antenna circuit and a method of optimisation thereof

Compounds which exhibit antiviral activity, particularly against influenza virus, and methods of making and using thereof are described herein. In one embodiment, the compounds are heterocyclic amides containing piperazine and isozazole rings and optionally substituted with one or more substituents. The compounds can be formulated with one or more pharmaceutically acceptable excipients to form compositions suitable for enteral or parenteral administration. The compounds are preferably used to treat or prevent Influenza A infections, such as H1N1, H2N2, H3N2, H5N1, H7N7, H1N2, H9N2, H7N2, H7N3, and H10N7.

Antiviral compounds and methods of making and using thereof

Provided herein are self-assembling compounds that can form ion channels in lipid bilayers or cell membranes and ion-channel-forming compositions comprising the self-assembling compounds. Also provided are methods of making and using the ion channels formed from a plurality of molecules of the self-assembling compounds. Further, provided are methods of treating or preventing conditions and diseases that are related to the dysfunction of ion channels, including chloride channels.

Synthetic ion channels

The present invention relates to a semiconductor device packaged at the wafer level such that an entire packaged device is formed prior to separation of individual devices. The semiconductor device package includes a semiconductor chip having one or more bonding pads associated with the chip and a protective layer bonded over the semiconductor chip. An insulation layer is positioned on at least side edges and a lower surface of the semiconductor chip. Interconnection/bump metallization is positioned adjacent one or more side edges of the semiconductor chip and is electrically connected to at least one bonding pad. A compact image sensor package can be formed that is vertically integrated with a digital signal processor and memory chip along with lenses and a protective cover.

Wafer-level device packaging

The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.

Partitioned hybrid substrate for radio frequency applications

This invention discloses a backside illuminated image sensor without the need to involve a mechanical grinding process or a chemical-mechanical planarization process in fabrication, and a fabricating method thereof. In one embodiment, an image sensor comprises a semiconductor substrate, a plurality of light sensing elements in the semiconductor substrate, and a cavity formed in the semiconductor substrate. The light sensing elements are arranged in a substantially planar manner. The cavity has a base surface overlying the light sensing elements. The presence of the cavity allows the image to reach the light sensing elements through the cavity base surface. The cavity can be fabricated by etching the semiconductor substrate. Agitation may also be used when carrying out the etching.

Low cost backside illuminated CMOS image sensor package with high integration

This invention discloses a through-silicon via (TSV) structure for providing an electrical path between a first-side surface and a second-side surface of a silicon chip, and a method for fabricating the structure. In one embodiment, the TSV structure comprises a via penetrated through the chip from the first-side surface to the second-side surface, providing a first end on the first-side surface and a second end on the second-side surface. A local isolation layer is deposited on the via's sidewall and on a portion of the first-side surface surrounding the first end. The TSV structure further comprises a plurality of substantially closely-packed microstructures arranged to form a substantially non-random pattern and fabricated on at least the portion of the first-side surface covered by the local isolation layer for promoting adhesion of the local isolation layer to the chip. A majority of the microstructures has a depth of at least 1 &#x3bc;m.

Through-silicon via structure with patterned surface, patterned sidewall and local isolation

A multilayer microelectronic device package includes one or more vertical electrical contacts. At least one semiconductor material layer is provided having one or more electrical devices fabricated therein. An electrical contact pad can be formed on or in the semiconductor material layer. Another material layer is positioned adjacent to the semiconductor material layer and includes a conductive material stud embedded in or bonded to the layer. A via is formed through at least a portion of the semiconductor material layer and the electrical contact pad and into the adjacent layer conducting material stud. The via is constructed such that the via tip terminates within the conducting material stud, exposing the conducting material. A metallization layer is disposed in the via such that the metallization layer contacts both the electrical contact pad and the conducting material stud exposed by the via tip.

Increased surface area electrical contacts for microelectronic packages

Growing community of inventors

Hong Kong, China

Dan Yang