IDiyas

For the Inventor, By the Inventor

Kiriat Ata, Israel

Dan Azeroual

USPTO Granted Patents = 13 

Average Co-Inventor Count = 1.9

ph-index = 3

Forward Citations = 29(Granted Patents)


Location History:

  • Kiryat Ata, IL (2010)
  • Kiriat Ata, IL (2012 - 2024)

Company Filing History:

goldMedal13 out of 599 
 
Marvell Israel (misl) Ltd.
 patents

Years Active: 2010-2025

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13 patents (USPTO):Explore Patents
1. 12295094 - Pad and via pattern arrangement for differential signal shielding (2025-05-06),
2. 11967587 - IC package with top-side memory module (2024-04-23),
3. 11917749 - Integrated circuit package differential pin pattern for cross-talk reduction (2024-02-27),
4. 11581292 - IC package with top-side memory module (2023-02-14),
5. 11508663 - PCB module on package (2022-11-22),
6. 11088123 - Package system having laterally offset and ovelapping chip packages (2021-08-10),
7. 11004778 - Polygonal BGA semiconductor package (2021-05-11),
8. 9565762 - Power delivery network in a printed circuit board structure (2017-02-07),
9. 9089060 - Ball-out for differential signals (2015-07-21),
10. 9083348 - Method and apparatus for tuning delay (2015-07-14),
11. 8803339 - Bump out for differential signals (2014-08-12),
12. 8164348 - Method and apparatus for tuning delay (2012-04-24),
13. 7838778 - Circuit board layout (2010-11-23),

Title: The Innovative Contributions of Dan Azeroual

Introduction

Dan Azeroual is a prominent inventor based in Kiriat Ata, Israel. He has made significant contributions to the field of printed circuit board (PCB) technology, holding a total of 13 patents. His work focuses on enhancing the performance and efficiency of electronic components.

Latest Patents

Among his latest patents is a groundbreaking design for a PCB that includes a pad and via pattern arrangement for differential signal shielding. This innovation features signal and ground pads strategically placed to optimize the performance of differential signal pad pairs. Another notable patent involves an integrated circuit (IC) package with a top-side memory module. This design allows for efficient heat dissipation while maintaining electrical connections between the main IC chip and memory modules.

Career Highlights

Dan Azeroual is currently employed at Marvell Israel Ltd., where he continues to push the boundaries of technology. His expertise in PCB design and integrated circuits has made him a valuable asset to the company. His innovative solutions have contributed to advancements in electronic device performance.

Collaborations

Dan collaborates with talented coworkers, including Liav Ben Artsi and Meir Hasko. Together, they work on various projects that aim to improve electronic systems and components.

Conclusion

Dan Azeroual's contributions to the field of PCB technology and integrated circuits highlight his role as a leading inventor. His patents reflect a commitment to innovation and excellence in electronic design.

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