The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Jul. 13, 2022
Applicant:

Marvell Israel (M.i.s.l) Ltd., Yokne'am, IL;

Inventors:

Dan Azeroual, Kiryat Ata, IL;

Liav Ben Artsi, Nahariya, IL;

David Katz, Hadera, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2005.12); H05K 1/11 (2005.12);
U.S. Cl.
CPC ...
H05K 1/0245 (2012.12); H05K 1/0216 (2012.12); H05K 1/111 (2012.12); H05K 1/0222 (2012.12); H05K 1/11 (2012.12);
Abstract

A printed circuit board (PCB) is provided herein, including signal and ground pads on a surface of the PCB. The signal pads are grouped into differential signal pad pairs, where each differential signal pad pair has a midpoint located halfway between the centers of the signal pads of the differential signal pad pair. A first differential signal pad pair is positioned on a first line, which intersects with both centers of the signal pads of the first differential signal pad pair. A second differential signal pad pair is positioned on a second line, which intersects with the centers of the signal pads of the second differential signal pad pair, parallel to the first line. Additionally, at least one ground pad is positioned along a line drawn from a midpoint of the first differential signal pad pair and a midpoint of the second differential signal pad pair.


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