Marvell Israel (misl) Ltd.

Dan Azeroual

Liav Ben Artsi

Meir Hasko

Eldad Bar-Lev

William B Weiser

Ronen Sinai

David Katz

A printed circuit board (PCB) is provided herein, including signal and ground pads on a surface of the PCB. The signal pads are grouped into differential signal pad pairs, where each differential signal pad pair has a midpoint located halfway between the centers of the signal pads of the differential signal pad pair. A first differential signal pad pair is positioned on a first line, which intersects with both centers of the signal pads of the first differential signal pad pair. A second differential signal pad pair is positioned on a second line, which intersects with the centers of the signal pads of the second differential signal pad pair, parallel to the first line. Additionally, at least one ground pad is positioned along a line drawn from a midpoint of the first differential signal pad pair and a midpoint of the second differential signal pad pair.

Pad and via pattern arrangement for differential signal shielding

A printed circuit board (PCB) system includes an integrated circuit (IC) package having a main IC chip that is electrically coupled to a top surface of a package substrate. A first printed circuit board (PCB) is electrically coupled to first contact structures on a bottom surface of the package substrate. A heat dissipation member is coupled to the main IC chip. A memory module is configured to electrically couple, via an interposer, with second contact structures on a top surface of the package substrate while the heat dissipation member dissipates heat from the main IC chip away from one or more memory IC chips on the memory module. The interposer is configured to electrically couple the second contact structures of the IC package with the memory module while the heat dissipation member dissipates heat from the main IC chip away from the one or more memory IC chips.

IC package with top-side memory module

An integrated circuit package, including a circuit board, signal pins extending orthogonally to the circuit board surface, and grouped into a plurality of differential signal pin pairs, each signal pin pair positioned at a vertex of an array of orthogonal rows and columns, wherein each signal pin pair includes a positive and a negative signal pin. The plurality of signal pin pairs includes a first subset of signal pin pairs wherein the positive and the negative signal pins are arranged in an orientation along a line parallel to rows of the array and a second subset of signal pin pairs in which the positive and the negative signal pins are arranged in an orientation along a line parallel to columns of the array. For each signal pin pair in one of the first and second subsets, each nearest signal pin pairs belong to another of the first and second subsets.

Integrated circuit package differential pin pattern for cross-talk reduction

A printed circuit board (PCB) system includes a first printed circuit board (PCB), an integrated circuit (IC) package, and a memory module. The IC package includes i) a package substrate, ii) a main IC chip that is electrically coupled to a top surface of the package substrate, iii) first contact structures that are disposed on a bottom surface of the package substrate and that are electrically coupled to the first PCB, and iv) second contact structures that are disposed on a top surface of the package substrate. The memory module includes i) a second PCB, ii) one or more memory IC chips that are disposed on the second PCB, and iii) third contact structures that are disposed on a bottom surface of the second PCB. An interposer electrically couples the second contact structures of the IC package with the third contact structures of the memory module.

Aspects of the disclosure provide a printed circuit board (PCB) system that includes an integrated circuit (IC) package, a first PCB and a PCB module. The IC package has a package substrate and an IC chip that is coupled to a top surface of the package substrate. The first PCB is configured to electrically couple with first contact structures that are disposed on a bottom surface of the package substrate. The PCB module includes a second PCB and one or more electronic components electrically coupled to the second PCB. The PCB module is configured to electrically couple with second contact structures that are disposed on the top surface of the package substrate.

PCB module on package

Aspects of the disclosure provide a package system that includes a first integrated circuit (IC) package and a second IC package. The first IC package includes a first IC chip mounted on a first substrate-chip surface of a first package substrate. The first package substrate includes first near-conductive layers that are closer to the first substrate-chip surface than first far-conductive layers. The second IC package includes a second IC chip mounted on a second substrate-chip surface of a second package substrate. The second package substrate includes second near-conductive layers that are closer to the second substrate-chip surface than second far-conductive layers. A first contact structure on the first substrate-chip surface and a second contact structure on the second substrate-chip surface electrically couple the first IC chip with the second IC chip through electrical connections in the first and second near-conductive layers.

Package system having laterally offset and ovelapping chip packages

A ball grid array (BGA) package for an integrated circuit device includes an integrated circuit device having a plurality of terminals, and two largest dimensions that define a major plane. A package substrate material encloses the integrated circuit device, and is formed, in a plane parallel to the major plane, into a polygon having at least five sides. An array of contacts on an exterior surface of the package substrate material is electrically coupled to the plurality of terminals. Contacts in the array of contacts are distributed in a pattern of contact positions, and the center of each contact position may be separated from the center of each nearest other position by a separation distance that is identical throughout the pattern. Each position may be occupied by a contact, or positions in a sub-pattern may lack a contact and may be available for insertion of at least one via.

Polygonal BGA semiconductor package

Aspects of the disclosure provide a printed circuit board (PCB) structure. The PCB structure includes a plurality of dielectric layers including an outer layer, a second layer disposed immediately below the outer layer, at least one first power plane disposed on at least one first internal layer of the PCB structure, and at least one first ground plane disposed on at least one second internal layer of the PCB structure. The PCB structure further includes an array of buried vias passing through at least the second layer configured to respectively connect power pads disposed on the second layer to the at least one first power plane and to connect ground pads disposed on the second layer to the at least one first ground plane. The array of buried vias is defined by columns of pads in which a respective column includes either power pads or ground pads, columns of power pads alternate with columns of ground pads, and pads of at least one of a column of power pads and a column of ground pads are staggered with respect to other pads of the at least one of the column of power pads and the column of ground pads. The PCB structure further includes an array of outer layer vias passing through the outer layer and configured to provide an electrical connection between one or more circuit components disposed on the outer layer and the second layer.

Power delivery network in a printed circuit board structure

Aspects of the disclosure provide a ball grid array (BGA) package. The ball grid array (BGA) package includes an integrated circuit (IC) packaged in the BGA package, first solder ball, a second solder ball and a third solder ball to transmit a first signal, a second signal, and a third signal. The first signal and the second signal are a pair of differential signals. The third solder ball has a substantially equal distance from the first solder ball and the second solder ball, and thus the first solder ball and the second solder ball are in symmetry with regard to the third solder ball.

Ball-out for differential signals

Aspects of the disclosure provide a method for tuning delay. The method includes driving, during a calibration stage, at least one test signal from an integrated circuit onto a plurality of outside transmission lines that are coupled to the integrated circuit, measuring a timing of the at least one test signal transmitted and reflected over the plurality of outside transmission lines, and selectively delaying, using units disposed within the integrated circuit, signals subsequently transmitted over the plurality of outside transmission lines based on the timing of the at least one test signal, in order to align transmission times of the subsequently transmitted signals.

Method and apparatus for tuning delay

An IC chip includes a matrix of solder bumps aligned in lines of a first axis and lines of a second axis. Adjacent solder bumps aligned in the first axis have a minimum distance and adjacent solder bumps aligned in the second axis have the minimum distance. The matrix includes a first pair of solder bumps aligned in a first line of the first axis and configured to transmit a first pair of differential signals, and a second pair of solder bumps aligned in a second line of the first axis next to the first line and configured to transmit a second pair of differential signals. The second pair of solder bumps are staggered from the first pair of the solder bumps to avoid in alignment with the first pair of solder bumps in the second axis.

Bump out for differential signals

Aspects of the disclosure can provide an integrated circuit (IC) chip. The IC chip may adjust delays at its interface to compensate for outside transmission line delays. The interface of the IC chip can include a plurality of input/output (IO) modules coupled to a plurality of outside transmission lines, respectively. Each of the IO module can further include at least one variable delay element configured to delay transmission over the corresponding outside transmission line based on an actually measured transmission delay of the outside transmission line, in order to align signals transmitted by the plurality of outside transmission lines in a desired manner.

A circuit board having a method therefor comprises a first circuit board layer comprising a first surface having disposed thereon a first plurality of lands arranged in three rows and comprising at least one group of the lands, wherein each group of the lands comprises first and second ones of the lands arranged in a first one of the rows, third, fourth, and fifth ones of the lands arranged in a second one of the rows, and sixth and seventh ones of the lands arranged in a third one of the rows, wherein the second one of the rows is adjacent to, and lies between, the first one of the rows and the third one of the rows; and respective traces extending from the first, second, third, fourth, fifth, and sixth ones of the lands between the sixth and seventh ones of the lands.

Growing community of inventors

Kiriat Ata, Israel

Dan Azeroual