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For the Inventor, By the Inventor

Boise, ID, United States of America

Damir Fazil

This inventor holds 21 USPTO granted patents and 8 published patent applications and 1 EPO patent. Top assignees: Micron Technology Incorporated, Intel Corporation, Lodestar Licensing Group LLC. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Damir Fazil. Retrieved from https://idiyas.com/inventor/damir-fazil

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 90.5

 

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:

goldMedal14 out of 39,176 
 
Micron Technology Incorporated
 patents
silverMedal2 out of 56,290 
 
Intel Corporation
 patents
bronzeMedal2 out of 218 
 
Lodestar Licensing Group LLC
 patents
where one patent can have more than one assignee

Years Active: 2017-2026

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21 patents (USPTO):Explore Patents
1. 12721129 - Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells (2026-08-25),
2. 12588212 - Integrated assemblies, and methods of forming integrated assemblies (2026-03-24),
3. 12568621 - Memory apparatus and methods including merged process for memory cell pillar and source structure (2026-03-03),
4. 12477732 - Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells (2025-11-18),
5. 12432925 - Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies (2025-09-30),
6. 12302571 - Microelectronic devices with pillars or openings extending through a tiered stack (2025-05-13),
7. 12232317 - Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells (2025-02-18),
8. 12010850 - Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies (2024-06-11),
9. 12004351 - Integrated assemblies, and methods of forming integrated assemblies (2024-06-04),
10. 11955330 - Microelectronic devices including an interdeck region between deck structures, and related electronic devices (2024-04-09),
11. 11744072 - Integrated assemblies which include stacked memory decks (2023-08-29),
12. 11706925 - Methods of forming electronic devices with channel openings or pillars extending through a tier stack (2023-07-18),
13. 11495617 - Electronic devices and systems with channel openings or pillars extending through a tier stack, and methods of formation (2022-11-08),
14. 11430809 - Integrated assemblies, and methods of forming integrated assemblies (2022-08-30),
15. 11393672 - Methods of forming microelectronic devices including an interdeck region between deck structures (2022-07-19),

Title: The Innovative Journey of Damir Fazil

Introduction: Damir Fazil, a talented inventor based in Boise, ID (US), has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Damir Fazil holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: Throughout his career, Damir Fazil has worked with leading tech companies to develop cutting-edge solutions that have revolutionized the industry. His passion for innovation and problem-solving has led to the creation of several groundbreaking products.

Collaborations: Damir Fazil has collaborated with top researchers, engineers, and scientists from around the world to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Damir Fazil's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true visionary in the field of inventions. His work continues to inspire and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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