Micron Technology Incorporated

Intel Corporation

Lodestar Licensing Group LLC

Damir Fazil

John David Hopkins

Justin B Dorhout

Nancy M Lomeli

Purnima Narayanan

Jivaan Kishore Jhothiraman

Nirup Bandaru

Joel D Peterson

Gordon A Haller

Anilkumar Chandolu

Hongbin Zhu

Albert Fayrushin

Christopher J Larsen

Prakash Rau Mokhna Rau

S M Istiaque Hossain

Arun Kumar Dhayalan

Jun Zhao

Rokibul Islam

Jordan D Greenlee

George Matamis

Lifang Xu

Paolo Tessariol

Indra V Chary

Erik R Byers

Dimitrios Pavlopoulos

Merri Lyn Carlson

Michael E Koltonski

Eldon Nelson

A memory array comprising strings of memory cells comprises a conductor tier comprising conductor material. Laterally-spaced memory blocks individually comprise a vertical stack comprising alternating insulative tiers and conductive tiers directly above the conductor tier. Channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. The channel material of individual of the channel-material strings is directly electrically coupled to the conductor material of the conductor tier. Intervening material is laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The intervening material comprises insulating material. The conductor material in the conductor tier comprises a pair of side interfaces that individually extend downwardly from a top of the conductor tier on one of opposing sides of the intervening material and individually extend longitudinally-along the immediately-laterally-adjacent memory blocks. The side interfaces have the conductor material laterally-over opposing sides thereof. Other embodiments, including method, are disclosed.

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Some embodiments include an integrated assembly having a first deck which has first memory cells, and having a second deck which has second memory cells. The first memory cells have first control gate regions which include a first conductive material vertically between horizontally-extending bars of a second conductive material. The second memory cells have second control gate regions which include a fourth conductive material along an outer surface of a third conductive material. A pillar passes through the first and second decks. The pillar includes a dielectric-barrier material laterally surrounding a channel material. The first and fourth materials are directly against the dielectric-barrier material. Some embodiments include methods of forming integrated assemblies.

Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies

Device, systems, and structures include a stack of vertically-alternating tiers of materials arranged in one or more decks of tiers. A channel opening, in which a channel pillar may be formed, extends through the stack. The pillar includes a 'shoulder portion' extending laterally into an “undercut portion” of the channel opening, which undercut portion is defined along at least a lower tier of at least one of the decks of the stack.

Microelectronic devices with pillars or openings extending through a tiered stack

A memory array comprises strings of memory cells. The memory array comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers above a conductor tier. Channel-material-string constructions of memory cells extend through the insulative tiers and the conductive tiers. The channel material of the channel-material-string constructions is directly electrically coupled to conductor material of the conductor tier. Substructure material is in the conductor tier and spans laterally-across and laterally-between bottoms of multiple of the channel-material-string constructions. The substructure material is of different composition from an upper portion of the conductor material. The substructure material comprises laterally-opposing sides that taper laterally-inward moving deeper into the conductor tier. Other embodiments, including method, are disclosed.

Some embodiments include an integrated assembly having a first deck. The first deck has first memory cell levels alternating with first insulative levels. A second deck is over the first deck. The second deck has second memory cell levels alternating with second insulative levels. A cell-material-pillar passes through the first and second decks. Memory cells are along the first and second memory cell levels and include regions of the cell-material-pillar. An intermediate level is between the first and second decks. The intermediate level includes a buffer region adjacent the cell-material-pillar. The buffer region includes a composition different from the first and second insulative materials, and different from the first and second conductive regions. Some embodiments include methods of forming integrated assemblies.

Integrated assemblies, and methods of forming integrated assemblies

A method of forming a microelectronic device comprises forming openings in an interdeck region and a first deck structure, the first deck structure comprising alternating levels of a first insulative material and a second insulative material, forming a first sacrificial material in the openings, removing a portion of the first sacrificial material from the interdeck region to expose sidewalls of the first insulative material and the second insulative material in the interdeck region, removing a portion of the first insulative material and the second insulative material in the interdeck region to form tapered sidewalls in the interdeck region, removing remaining portions of the first sacrificial material from the openings, and forming at least a second sacrificial material in the openings. Related methods of forming a microelectronic devices and related microelectronic devices are disclosed.

Microelectronic devices including an interdeck region between deck structures, and related electronic devices

Integrated assemblies which include stacked memory decks

Device, systems, and structures include a stack of vertically-alternating tiers of materials arranged in one or more decks of tiers. A channel opening, in which a channel pillar may be formed, extends through the stack. The pillar includes a 'shoulder portion' extending laterally into an 'undercut portion' of the channel opening, which undercut portion is defined along at least a lower tier of at least one of the decks of the stack.

Methods of forming electronic devices with channel openings or pillars extending through a tier stack

Electronic devices and systems with channel openings or pillars extending through a tier stack, and methods of formation

Methods of forming microelectronic devices including an interdeck region between deck structures

A method used in forming a memory array comprises forming a stack comprising vertically-alternating insulative tiers and wordline tiers. The stack comprises an insulator tier above the wordline tiers. The insulator tier comprises first insulator material comprising silicon, nitrogen, and one or more of carbon, oxygen, boron, and phosphorus. The first insulator material is patterned to form first horizontally-elongated trenches in the insulator tier. Second insulator material is formed in the first trenches along sidewalls of the first insulator material. The second insulator material is of different composition from that of the first insulator material and narrows the first trenches. After forming the second insulator material, second horizontally-elongated trenches are formed through the insulative tiers and the wordline tiers. The second trenches are horizontally along the narrowed first trenches laterally between and below the second insulator material. Elevationally-extending strings of memory cells are formed in the stack. Structure independent of method is disclosed.

Memory arrays and methods used in forming a memory array

Methods of forming integrated assemblies include stacked memory decks

A method used in forming a memory array comprises forming a conductive tier atop a substrate, with the conductive tier comprising openings therein. An insulator tier is formed atop the conductive tier and the insulator tier comprises insulator material that extends downwardly into the openings in the conductive tier. A stack comprising vertically-alternating insulative tiers and wordline tiers is formed above the insulator tier. Strings comprising channel material that extend through the insulative tiers and the wordline tiers are formed. The channel material of the strings is directly electrically coupled to conductive material in the conductive tier. Structure independent of method is disclosed.

Growing community of inventors

Boise, ID, United States of America

Damir Fazil