Craig Higgins

Title: The Innovations of Craig Higgins

Introduction

Craig Higgins is a notable inventor based in Cedar Park, CA (US). He has made significant contributions to the field of lithography, particularly in the area of extreme ultraviolet (EUV) lithography. With a total of 4 patents to his name, Higgins continues to push the boundaries of technology and innovation.

Latest Patents

Higgins' latest patents focus on methods to calibrate, predict, and control stochastic defects in EUV lithography. One of his patents describes a process where an initial probability of occurrence of a stochastic defect over an inspection area of a workpiece is received. The locations of these defects are sorted by their initial probability of occurrence. A cumulative expected defect count is determined and normalized to be a fraction of the total expected defect count. This method allows for the identification of defect locations that capture potential stochastic defects above a certain threshold. Another patent elaborates on imaging one or more defects within the inspection area using an optical tool or an electron beam tool. It generates a probability of occurrence for each defect location, allowing for a more refined analysis and model tuning based on observed results.

Career Highlights

Higgins is currently employed at Kla Corporation, a leading company in the field of lithography and semiconductor manufacturing. His work at Kla Corporation has positioned him as a key player in advancing technologies that are critical to the semiconductor industry.

Collaborations

Throughout his career, Higgins has collaborated with talented individuals such as Cao Zhang and Guy Parsey. These collaborations have fostered an environment of innovation and have contributed to the successful development of his patents.

Conclusion

Craig Higgins exemplifies the spirit of innovation in the field of lithography. His contributions through his patents and work at Kla Corporation highlight his commitment to advancing technology. His ongoing efforts continue to shape the future of semiconductor manufacturing.