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For the Inventor, By the Inventor

Tainan, Taiwan

Chung-Bin Tseng

USPTO Granted Patents = 11

Average Co-Inventor Count = 5.6

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:

goldMedal11 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2024

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11 patents (USPTO):
1. 12094997 - BSI chip with backside alignment mark (2024-09-17),
2. 11430909 - BSI chip with backside alignment mark (2022-08-30),
3. 10665466 - Method for forming semiconductor device structure (2020-05-26),
4. 10658269 - Semiconductor structure and manufacturing method of the same (2020-05-19),
5. 10269684 - Semiconductor structure and manufacuting method of the same (2019-04-23),
6. 10163646 - Method for forming semiconductor device structure (2018-12-25),
7. 10056316 - Manufacuting method of semiconductor structure (2018-08-21),
8. 10008530 - Image sensing device and manufacturing method thereof (2018-06-26),
9. 9831154 - Semiconductor structure and manufacuting method of the same (2017-11-28),
10. 9691809 - Backside illuminated image sensor device having an oxide film and method of forming an oxide film of a backside illuminated image sensor device (2017-06-27),
11. 9583356 - Method for forming semiconductor device structure (2017-02-28),

Title: Innovations of Chung-Bin Tseng

Introduction

Chung-Bin Tseng is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work primarily focuses on image sensors and semiconductor substrates, showcasing his expertise and innovative spirit.

Latest Patents

One of his latest patents involves a BSI chip with a backside alignment mark. This method includes forming image sensors in a semiconductor substrate. A first alignment mark is created close to the front side of the semiconductor substrate. The process further entails performing a backside polishing operation to thin the semiconductor substrate. This results in the formation of a second alignment mark on the backside of the semiconductor substrate. A feature is then formed on the backside of the semiconductor substrate, utilizing the second alignment mark for precise alignment.

Career Highlights

Chung-Bin Tseng has established a successful career at Taiwan Semiconductor Manufacturing Company Limited. His innovative approaches and technical skills have significantly advanced the company's capabilities in semiconductor manufacturing.

Collaborations

He has collaborated with notable coworkers, including Keng-Ying Liao and Po-Zen Chen, contributing to various projects that enhance the company's technological advancements.

Conclusion

Chung-Bin Tseng's contributions to semiconductor technology and his innovative patents reflect his dedication to advancing the field. His work continues to influence the industry and inspire future innovations.

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