The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Feb. 27, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Keng-Ying Liao, Tainan, TW;

Chung-Bin Tseng, Tainan, TW;

Po-Zen Chen, Tainan, TW;

Yi-Hung Chen, Kaohsiung, TW;

Yi-Jie Chen, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01L 21/0276 (2013.01); H01L 21/0337 (2013.01); H01L 21/28035 (2013.01); H01L 21/28123 (2013.01); H01L 21/3081 (2013.01); H01L 21/3085 (2013.01); H01L 21/31127 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 21/32137 (2013.01); H01L 21/32139 (2013.01); H01L 29/66568 (2013.01); H01L 29/66575 (2013.01); H01L 29/78 (2013.01);
Abstract

A method for forming a semiconductor device structure is provided. The semiconductor device structure includes forming a film over a substrate. The semiconductor device structure includes forming a first mask layer over the film. The semiconductor device structure includes forming a second mask layer over the first mask layer. The second mask layer exposes a first portion of the first mask layer. The semiconductor device structure includes performing a plasma etching and deposition process to remove the first portion of the first mask layer and to form a protection layer over a first sidewall of the second mask layer. The first mask layer exposes a second portion of the film after the plasma etching and deposition process. The semiconductor device structure includes removing the second portion using the first mask layer and the second mask layer as an etching mask.


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