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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chun-Sheng Chen

This inventor holds 11 USPTO granted patents and 3 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Mosel Vitelic Corporation, Industrial Technology Research Institute. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Sheng Chen. Retrieved from https://idiyas.com/inventor/chun-sheng-chen-yd9na6f7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 72.7

Average Co-Inventor Count = 5.1

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:

goldMedal7 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 443 
 
Mosel Vitelic Corporation
 patents
bronzeMedal1 out of 9,308 
 
Industrial Technology Research Institute
 patents
4. 1 out of 491 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2002-2026

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11 patents (USPTO):Explore Patents
1. 12772471 - Method for manufacturing insulated gate bipolar transistor with laser pre-treatment process (2026-10-20),
2. 12575344 - Interconnect structures and methods and apparatuses for forming the same (2026-03-10),
3. 12400862 - Interconnect structures and methods and apparatuses for forming the same (2025-08-26),
4. 12354910 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-08),
5. 12347728 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2025-07-01),
6. 12080594 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2024-09-03),
7. 11854878 - Bi-layer alloy liner for interconnect metallization and methods of forming the same (2023-12-26),
8. 11694899 - Interconnect structures and methods and apparatuses for forming the same (2023-07-04),
9. 11430692 - Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same (2022-08-30),
10. 11031496 - MOSFET and manufacturing method thereof (2021-06-08),
11. 6416625 - Manufacturing method of fluoro based composite boards (2002-07-09),

Title: The Innovative Journey of Chun-Sheng Chen

Introduction: Chun-Sheng Chen, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations and patents.

Latest Patents: Chun-Sheng Chen's latest patents include advancements in semiconductor technology, renewable energy systems, and artificial intelligence algorithms, showcasing his diverse range of expertise and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Chun-Sheng Chen has held key positions in leading tech companies, where he spearheaded research and development projects that have led to numerous successful patent applications and product launches.

Collaborations: Throughout his career, Chun-Sheng Chen has collaborated with top researchers, engineers, and scientists from renowned universities and research institutions worldwide, fostering a culture of innovation and knowledge exchange that has been instrumental in his success.

Conclusion: Chun-Sheng Chen's relentless pursuit of innovation, coupled with his passion for pushing the boundaries of technology, has solidified his reputation as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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