This inventor holds 123 USPTO granted patents and 18 published patent applications, primarily in BioFET Technology (CPC class G01N27-4145). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2011-2026.
Inventors with similar research interests:
Location History:
- Hsinchu County, TW (2016)
- Hsin-Chu, TW (2011 - 2024)
- Hsinchu, TW (2024)
Company Filing History:
122 out of 42,759 
1 out of 463 Years Active: 2011-2026
Areas of Expertise:
Title: Innovator Spotlight: Chun-Ren Cheng and his Cutting-edge Patents
Introduction:
Innovation knows no boundaries, and Taiwanese inventor Chun-Ren Cheng is testament to this fact. With an extensive portfolio of 100 patents under his belt, Cheng has made significant contributions to the field of semiconductor manufacturing and piezoelectric device technology. In this article, we delve into two of his latest patents and explore his association with Taiwan Semiconductor Manufacturing Company Limited.
Latest Patents:
1. Integrated Heater (and related method) to Recover Degraded Piezoelectric Device Performance:
Cheng's patent focuses on a novel solution to recover the degraded electrical properties of a piezoelectric device. The device consists of a semiconductor substrate, a first electrode, a piezoelectric structure, a second electrode, and a heating element. By heating the piezoelectric structure to a recovery temperature for a specific period, the electrical performance of the device is significantly improved. This innovation promises greater reliability and longevity for piezoelectric devices, which have numerous applications in various industries.
2. Manufacturing Method of Semiconductor Structure:
Cheng's second patent discloses a method for manufacturing a semiconductor structure, targeting improved efficiency and stability. The manufacturing process involves several significant steps. Notably, the method employs a plate with a semiconductive member and two tensile members, along with a membrane incorporating holes. Conductive plugs passing through the plate or membrane are used, with semiconductive pads formed over these plugs. Finally, the plate is bonded to a second substrate, connecting the semiconductive pads with the bond pads on the substrate. This method offers enhanced performance and reliability in the production of semiconductor structures.
Taiwan Semiconductor Manufacturing Company Limited:
Chun-Ren Cheng's impressive body of work is closely tied to Taiwan Semiconductor Manufacturing Company Limited (TSMC). TSMC, headquartered in Hsinchu, Taiwan, is the world's largest dedicated independent semiconductor foundry. It plays a pivotal role in the development and manufacturing of advanced semiconductor devices that power various industries.
Notable Coworkers: Yi-Hsien Chang and Yi-Shao Liu:
In the pursuit of innovation, collaboration plays a vital role. Cheng has had the privilege of working alongside noteworthy colleagues, including Yi-Hsien Chang and Yi-Shao Liu. Their collective expertise and contributions have further enriched the research and development efforts within TSMC, cementing its reputation as a global leader in the semiconductor industry.
Conclusion:
Chun-Ren Cheng's remarkable inventions and extensive patent portfolio demonstrate his commitment to pushing the boundaries of technology in the semiconductor manufacturing and piezoelectric device domains. With his association with Taiwan Semiconductor Manufacturing Company Limited, Cheng continues to be at the forefront of technological advancements, driving innovation and shaping the future of the industry.