Hsinchu, Taiwan

Chun-Ming Hu


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2007-2022

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11 patents (USPTO):Explore Patents

Title: Innovations of Chun-Ming Hu

Introduction

Chun-Ming Hu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on improving overlay control and error reduction in semiconductor processing.

Latest Patents

One of his latest patents is titled "Noise reduction for overlay control." This patent describes a system that includes a metrology tool designed to collect overlay errors from a patterned substrate. The system features a controller module that generates overlay compensation from the collected errors. This process involves identifying outliers among the overlay errors and filtering them to create a set of filtered overlay errors for compensation calculation.

Another notable patent is the "System and method for overlay error reduction." This invention outlines a method where a semiconductor wafer is flipped and rotated during the patterning of its front and back sides using first and second reticles. The method ensures precise patterning by flipping the wafer and aligning it correctly for the second layer application.

Career Highlights

Chun-Ming Hu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has significantly impacted the efficiency and accuracy of semiconductor manufacturing processes.

Collaborations

Chun-Ming Hu has collaborated with notable colleagues, including Chih-Ming Ke and Yang-Hung Chang. Their combined expertise has contributed to advancements in semiconductor technology.

Conclusion

Chun-Ming Hu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and improve manufacturing processes.

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