The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Sep. 24, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Bi-Ming Yen, Hsinchu, TW;

Tsai-Chun Li, Hsinchu, TW;

Chun-Ming Hu, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01L 21/0276 (2013.01); H01L 21/02118 (2013.01); H01L 21/02123 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/31133 (2013.01); H01L 21/31138 (2013.01); H01L 21/76816 (2013.01);
Abstract

A method of making a semiconductor device includes forming an intermediate semiconductor device. The intermediate device includes a substrate; and a dielectric layer over the substrate. The intermediate device includes a first layer set, including a silicon-rich photoresist material, over the dielectric layer. The intermediate device includes a second layer set, including a carbon-rich organic material layer, over the first layer set. The method further includes etching the second layer set to form a tapered opening in the second layer set. The method further includes etching the first layer set to form an opening in the first layer set, wherein etching the first layer set comprises removing the carbon-rich organic material layer. The method further includes etching the dielectric layer using the first layer set as a mask to form an opening in the dielectric layer, wherein etching the dielectric layer comprises reducing a thickness of the first layer set.


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