The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Sep. 13, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chih-Ming Ke, Hsinchu, TW;

Ching-Pin Kao, Tainan, TW;

Yang-Hung Chang, Taipei, TW;

Kai-Hsiung Chen, New Taipei, TW;

Chun-Ming Hu, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 19/00 (2011.01); G21K 5/00 (2006.01); G01R 31/26 (2014.01); G06K 9/00 (2006.01); H01L 21/66 (2006.01); G03F 1/36 (2012.01); G03F 1/00 (2012.01); G03F 1/70 (2012.01); G03F 1/68 (2012.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); G06F 17/5068 (2013.01); G05B 2219/45031 (2013.01); G03F 1/144 (2013.01); G05B 2219/45029 (2013.01); G03F 1/36 (2013.01); G03F 1/70 (2013.01); G03F 1/68 (2013.01);
Abstract

The present disclosure provides methods and systems for providing a similarity index in semiconductor process control. One of the methods disclosed herein is a method for semiconductor fabrication process control. The method includes steps of receiving a first semiconductor device wafer and receiving a second semiconductor device wafer. The method also includes a step of collecting metrology data from the first and second semiconductor device wafers. The metrology data includes a first set of vectors associated with the first semiconductor device wafer and a second set of vectors associated with the second semiconductor device wafer. The method includes determining a similarity index based in part on a similarity index value between a first vector from the first set of vectors and a second vector from the second set of vectors and continuing to process additional wafers under current parameters when the similarity index is above a threshold value.


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