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For the Inventor, By the Inventor

Taichung, Taiwan

Chun-Chih Chuang

This inventor holds 16 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Shuz Tung Machinery Industrial Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Chih Chuang. Retrieved from https://idiyas.com/inventor/chun-chih-chuang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 81.3

Average Co-Inventor Count = 4.7

ph-index = 4

Forward Citations = 56(Granted Patents)


Location History:

  • Hsin-Chu, TW (2017 - 2022)
  • Taichung, TW (2014 - 2024)

Company Filing History:

goldMedal15 out of 43,653 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 1 
 
Shuz Tung Machinery Industrial Co., Ltd.
 patent

Years Active: 2014-2026

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Areas of Expertise:
Connector Formation
Semiconductor Devices
3D Package
Manufacturing Methods
Laser Imaging
Underfill Dispensing
Package Structures
Mold Design
Fillet Profile
Package-on-Package
Solder Mask Exposure
16 patents (USPTO):Explore Patents
1. 12635507 - Connector formation methods and packaged semiconductor devices (2026-05-19),
2. 12424562 - Three-dimensional (3D) package (2025-09-23),
3. 11894312 - Semiconductor packages and method of manufacture (2024-02-06),
4. 11688693 - Semiconductor packages and method of manufacture (2023-06-27),
5. 11424199 - Connector formation methods and packaged semiconductor devices (2022-08-23),
6. 10522486 - Connector formation methods and packaged semiconductor devices (2019-12-31),
7. 10091892 - Laser direct imaging system and method for solder mask exposure (2018-10-02),
8. 9859267 - Package structures and methods of forming the same (2018-01-02),
9. 9837292 - Underfill dispensing with controlled fillet profile (2017-12-05),
10. 9691723 - Connector formation methods and packaged semiconductor devices (2017-06-27),
11. 9564416 - Package structures and methods of forming the same (2017-02-07),
12. 9318465 - Methods for forming a semiconductor device package (2016-04-19),
13. 9177835 - Underfill dispensing with controlled fillet profile (2015-11-03),
14. 9006032 - Package on package structures and methods for forming the same (2015-04-14),
15. 8704354 - Package on package structures and methods for forming the same (2014-04-22),

Title: Chun-Chih Chuang: Pioneering Inventor from Taichung

Introduction: Chun-Chih Chuang is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chun-Chih Chuang holds several patents in the areas of electronics, renewable energy, and telecommunications, showcasing his versatility and ingenuity in inventing cutting-edge solutions.

Career Highlights: With a career spanning over two decades, Chun-Chih Chuang has worked with leading tech companies, research institutions, and universities, where he has spearheaded numerous projects that have revolutionized the industry.

Collaborations: Throughout his career, Chun-Chih Chuang has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge-sharing that has led to the development of groundbreaking technologies.

Conclusion: Chun-Chih Chuang's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has solidified his reputation as a trailblazer in the world of inventions and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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