The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Aug. 15, 2012
Jung Wei Cheng, Hsinchu, TW;
Tsung-ding Wang, Tainan, TW;
Chien-hsun Lee, Chu-tung Town, TW;
Chun-chih Chuang, Taichung, TW;
Jung Wei Cheng, Hsinchu, TW;
Tsung-Ding Wang, Tainan, TW;
Chien-Hsun Lee, Chu-tung Town, TW;
Chun-Chih Chuang, Taichung, TW;
Abstract
The described embodiments of forming bonding structures for package on package involves removing a portion of connectors and molding compound of the lower package. The described bonding mechanisms enable easier placement and alignment of connectors of an upper package to with connector of a lower package. As a result, the process window of the bonding process is wider. In addition, the bonding structures have smoother join profile and planar joint plane. As a result, the bonding structures are less likely to crack and also are less likely to crack. Both the yield and the form factor of the package on package structure are improved.