Chueh-An Hsieh

Title: Chueh-An Hsieh: Innovator in Semiconductor Technology

Introduction

Chueh-An Hsieh is a prominent inventor based in Kao-Hsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work focuses on processes that enhance the efficiency and functionality of electronic components.

Latest Patents

Hsieh's latest patents include a substrate process for an embedded component. This process involves forming a first dielectric layer on a mold with protruding components, which covers these components. An electronic component is then placed on this layer, ensuring that its active surface faces the dielectric layer. The design allows for the creation of openings that expose the contacts of the electronic component after the mold is removed. Another notable patent is related to a bumping process and its structure. This process includes several steps, such as forming a UBM layer on a pad and coating it with a conductive photo-resist layer. The process culminates in the formation of a solder layer through electroplating, ensuring reliable electric connections.

Career Highlights

Chueh-An Hsieh is currently employed at Advanced Semiconductor Engineering, Inc. His work at this leading company has allowed him to push the boundaries of semiconductor technology. Hsieh's innovative approaches have contributed to advancements in the manufacturing processes of electronic components.

Collaborations

Hsieh has collaborated with notable colleagues, including Li-Cheng Tai and Shyh-Ing Wu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Chueh-An Hsieh is a key figure in the semiconductor industry, with a focus on innovative processes that improve electronic component functionality. His contributions through patents and collaborations highlight his commitment to advancing technology in this field.