The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Aug. 11, 2006
Chueh-an Hsieh, Kaohsiung, TW;
Li-cheng Tai, Kaohsiung, TW;
Shyh-ing Wu, Kaohsiung, TW;
Shih-kuang Chen, Kaohsiung, TW;
Chueh-An Hsieh, Kaohsiung, TW;
Li-Cheng Tai, Kaohsiung, TW;
Shyh-Ing Wu, Kaohsiung, TW;
Shih-Kuang Chen, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A bumping process and a structure thereof are provided. The bumping process includes the following steps. Firstly, a wafer having a number of pads is provided. Next, a UBM layer is formed on the pad. Then, a conductive first photo-resist layer is coated on the wafer to cover the UBM layer. Next, a second photo-resist layer is coated on the first photo-resist layer. Then, at least a portion of the second photo-resist layer is removed to form an opening above the UBM layer. The first photo-resist layer maintains electric connection with the UBM layer. Next, a solder layer is formed in the opening by electroplating process. Then, the first photo-resist layer and the second photo-resist layer are removed expect the portion of the first photo-resist layer under the solder layer.