Kao-Hsiung Hsien, Taiwan

Li-Cheng Tai


Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Kao-Hsiung Hsien, TW (2009 - 2010)
  • Kaohsiung, TW (2009 - 2010)

Company Filing History:


Years Active: 2009-2010

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4 patents (USPTO):Explore Patents

Title: Innovations of Li-Cheng Tai

Introduction

Li-Cheng Tai is a notable inventor based in Kao-Hsiung Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced processes that enhance the functionality and efficiency of electronic components.

Latest Patents

Li-Cheng Tai's latest patents include innovative processes such as the "Substrate process for an embedded component." This patent describes a method where a first dielectric layer is formed on a mold with protruding components, allowing for the integration of electronic components in a compact manner. Another significant patent is the "Bumping process and structure thereof," which outlines a detailed procedure for creating solder layers on semiconductor wafers, ensuring reliable electrical connections.

Career Highlights

Li-Cheng Tai is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His expertise in the field has led to the development of cutting-edge processes that are crucial for modern electronics.

Collaborations

Throughout his career, Li-Cheng Tai has collaborated with talented individuals such as Chueh-An Hsieh and Shyh-Ing Wu. These collaborations have fostered an environment of innovation and creativity, contributing to the advancement of semiconductor technologies.

Conclusion

Li-Cheng Tai's contributions to the field of semiconductor technology are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of electronic components.

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