The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Aug. 31, 2006
Li-cheng Tai, Kaohsiung, TW;
Jui-i Yu, Kaohsiung, TW;
Jiunn Chen, Kaohsiung, TW;
Chueh-an Hsieh, Kaohsiung, TW;
Shyh-ing Wu, Kaohsiung, TW;
Shih-kuang Chen, Kaohsiung, TW;
Tsung-chieh Ho, Kaohsiung, TW;
Tsung-hua Wu, Kaohsiung, TW;
Li-Cheng Tai, Kaohsiung, TW;
Jui-I Yu, Kaohsiung, TW;
Jiunn Chen, Kaohsiung, TW;
Chueh-An Hsieh, Kaohsiung, TW;
Shyh-Ing Wu, Kaohsiung, TW;
Shih-Kuang Chen, Kaohsiung, TW;
Tsung-Chieh Ho, Kaohsiung, TW;
Tsung-Hua Wu, Kaohsiung, TW;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
A wafer structure including a semiconductor substrate, a number of UBM layers and a number of bumps is provided. The semiconductor substrate has an active surface, a number of bonding pads and a passivation layer. The bonding pads are positioned on the active surface of the semiconductor substrate. The passivation layer covers the active surface of the semiconductor substrate and exposes the bonding pads. The UBM layers are respectively arranged on the bonding pads, and each UBM layer includes an adhesive layer, a super-lattice barrier layer and a wetting layer. The adhesion layer is disposed on bonding pads. The super-lattice barrier layer is disposed on the adhesion layer and includes a number of alternately stacked sub-barrier layers and sub-wetting layers. The wetting layer is disposed on the super-lattice barrier layer, and the bump is disposed on the wetting layer.