The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
Oct. 17, 2006
Chueh-an Hsieh, Kao-Hsiung, TW;
Li-cheng Tai, Kao-Hsiung Hsien, TW;
Chueh-An Hsieh, Kao-Hsiung, TW;
Li-Cheng Tai, Kao-Hsiung Hsien, TW;
Advanced Semiconductor Engineering, Inc., Kao-Hsiung, TW;
Abstract
A method for forming bumps is disclosed. First, a substrate having a surface and an under bump metallurgy layer formed thereon is provided, and a portion of the under bump metallurgy layer is removed thereafter. Next, a mask having a metal layer thereon is disposed over the surface of substrate, in which the mask includes at least one opening for exposing the under bump metallurgy layer. Subsequently, a metal is disposed in the opening and the mask having the metal layer is removed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile