Hsinchu, Taiwan

Chuan-Pu Chou

This inventor holds 3 USPTO granted patents and 6 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025-2026.

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 5.1

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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3 patents (USPTO):Explore Patents

Title: The Innovations of Chuan-Pu Chou

Introduction

Chuan-Pu Chou is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a patent that enhances heat dissipation in semiconductor structures.

Latest Patents

Chou holds a patent for a semiconductor structure with improved heat dissipation. This semiconductor structure includes a substrate and a device region formed over the substrate. Additionally, it features an interconnect structure formed over the device region and a first passivation layer over the interconnect structure. A metal pad is formed over and extends into the first passivation layer, while a second passivation layer is formed over the first passivation layer. Notably, the second passivation layer includes a thermal conductive material with a thermal conductivity higher than 4 W/mK. Chuan-Pu Chou has 1 patent to his name.

Career Highlights

Chuan-Pu Chou is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading entity in the semiconductor industry. His work at this company has allowed him to contribute to cutting-edge technologies and advancements in semiconductor design.

Collaborations

Chou has collaborated with notable colleagues, including Cheng-Chin Lee and Shau-Lin Shue. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Chuan-Pu Chou's innovative contributions to semiconductor technology demonstrate his expertise and commitment to advancing the field. His patent for a semiconductor structure with improved heat dissipation is a testament to his ingenuity and the impact of his work in the industry.

Profile summary based on public USPTO records.
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