Taiwan Semiconductor Manufacturing Comp. Ltd.

Chuan-Pu Chou

Shau-Lin Shue

Chia-Tien Wu

Hsin-Yen Huang

Shao-Kuan Lee

Cheng-Chin Lee

Ming-Hsien Lin

Hsin-Ping Chen

Kai-Fang Cheng

Cherng-Shiaw Tsai

Hsiao-Kang Chang

Kuang-Wei Yang

A semiconductor structure is provided. The semiconductor structure includes a substrate and a device region formed over the substrate. The semiconductor structure further includes an interconnect structure formed over the device region and a first passivation layer formed over the interconnect structure. The semiconductor structure also includes a metal pad formed over and extending into the first passivation layer and a second passivation layer formed over the first passivation layer. The second passivation layer includes a thermal conductive material, and the thermal conductivity of the thermal conductive material is higher than 4 W/mK.

Semiconductor structure with improved heat dissipation

Growing community of inventors

Hsinchu County, Taiwan

Chuan-Pu Chou