Hsinchu, Taiwan

Ching-Yi Hsu

This inventor holds 19 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Technology. Top assignees: Vanguard International Semiconductor Corporation, Industrial Technology Research Institute, A.u. Vista Inc.. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Yi Hsu. Retrieved from https://idiyas.com/inventor/ching-yi-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19 

% Patents Active = 89.5

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Kaohsiung, TW (2012)
  • Hsinchu, TW (2007 - 2022)

Company Filing History:


Years Active: 2007-2026

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Areas of Expertise:
Semiconductor Structure
Fabrication Method
Display Device
Isolation Structure
Wireless Signal Transmission
High Voltage Device
Transferring Dies
Backlight Module
Source Driver
Trench Isolation
Mass Transferring Process
Pollution Tracking
19 patents (USPTO):Explore Patents

Title: Ching-Yi Hsu: Innovator in Semiconductor Technology

Introduction

Ching-Yi Hsu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 19 patents. His innovative work has advanced various processes and systems within the industry.

Latest Patents

One of his latest patents is titled "Structure of transferring dies for use in mass transferring process." This invention features a structure that includes an oxide layer supporting feature, multiple dies, a bonding feature, a supporting wafer, and a spacer. The oxide layer supporting feature consists of multiple repeating units, each with a die setting region and a peripheral region. The die is positioned on the die setting region, while the bonding feature is located on the peripheral region of the oxide layer supporting feature. The supporting wafer is situated beneath the oxide layer supporting feature, separated from the die and bonding feature by a gap. The spacer is placed between the bonding feature and the supporting wafer, bonded to the bonding feature.

Another notable patent is "Display system and method for forming an output buffer of a source driver." This display system comprises a plurality of pixels connected to multiple gate lines and source lines. A gate driver supplies gate signals to the gate lines, while a source driver provides image signals to the source lines. The source driver includes an output buffer that features a transistor, which can be a native transistor device, a depletion-mode transistor device, or a low-threshold transistor device.

Career Highlights

Ching-Yi Hsu has worked with several esteemed organizations throughout his career. He has been associated with Vanguard International Semiconductor Corporation and the Industrial Technology Research Institute. His experience in these companies has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Ching-Yi has collaborated with notable colleagues, including Chih-Cherng Liao and Yun-Chou Wei. These partnerships have fostered a creative environment that has led to the development of advanced technologies and solutions.

Conclusion

Ching-Yi Hsu's contributions to semiconductor technology through his numerous patents and collaborations highlight his role as an influential inventor in the field. His innovative spirit continues to drive advancements that shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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