Taipei, Taiwan

Ching-Fu Chang

This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Fu Chang. Retrieved from https://idiyas.com/inventor/ching-fu-chang-dmbkc92l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 63(Granted Patents)


Company Filing History:


Years Active: 2017-2024

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Areas of Expertise:
Semiconductor Structure
Integrated Fan-Out Package
Manufacturing Method
Package Structure
Conductive Pattern
Bump Technology
Fabrication Method
Thermal Management
3D Packaging
TSV Interconnects
18 patents (USPTO):Explore Patents

Title: Innovations and Patents of Ching-Fu Chang in Semiconductor Technologies

Introduction

Ching-Fu Chang is a renowned inventor based in Taipei, Taiwan, recognized for his significant contributions to semiconductor technologies. With a remarkable portfolio of 18 patents, he has made strides in advancing the functionality and efficiency of semiconductor structures and packages.

Latest Patents

Chang's latest patents showcase his innovative approach to semiconductor design. One of his prominent inventions is a semiconductor structure that features a die encompassed by a molding. This design includes a first dielectric layer above the die and molding and a second dielectric layer positioned between them. Notably, the material content ratio in the first dielectric layer is substantially greater than in the second layer, which inversely affects the mechanical strength of both layers.

Another significant patent is for an integrated fan-out package that comprises an integrated circuit, insulating encapsulation, and a redistribution circuit structure. This package includes an antenna region and a unique configuration of a wiring-free dielectric portion positioned between an inductor and a dummy region that features several embedded dummy patterns. These advancements highlight Chang's commitment to enhancing semiconductor applications.

Career Highlights

Ching-Fu Chang's career principally unfolds at Taiwan Semiconductor Manufacturing Company Limited (TSMC), where he plays a pivotal role in semiconductor innovations. His extensive experience and technical expertise have allowed him to contribute significantly to TSMC's reputation as a leading semiconductor manufacturer.

Collaborations

Throughout his career, Chang has collaborated with talented colleagues such as Hsin-Chieh Huang and Ming-Yen Chiu. These collaborations have enabled him to innovate and refine semiconductor technologies further, solidifying his status in the field.

Conclusion

Ching-Fu Chang's impressive array of patents and his ongoing work at Taiwan Semiconductor Manufacturing Company Limited showcase his dedication to advancing semiconductor technology. Through his innovations, he continues to influence the semiconductor industry, paving the way for future developments and enhancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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