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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10692809 B1

PDFFull Text
Date of Patent:
Jun. 23, 2020

Filed:

Oct. 29, 2018

Manufacturing method for semiconductor structure

Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Hsi-Kuei Cheng, Hsinchu County, TW;

Chih-Kang Han, Hsin-Chu, TW;

Ching-Fu Chang, Taipei, TW;

Hsin-Chieh Huang, Hsin-Chu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;

Attorneys:

WPAT, P.C., Intellectual Property Attorneys

Anthony King

Primary Examiner:

Alexander O Williams

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/4857 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/3192 (2013.01); H01L 23/5389 (2013.01); H01L 24/08 (2013.01); H01L 24/94 (2013.01); H01L 23/49816 (2013.01); H01L 23/562 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08112 (2013.01);
Abstract

A method of manufacturing a semiconductor structure is provided. The method includes providing a substrate, disposing a die over the substrate, forming a molding over the substrate and around the die, disposing a first dielectric layer over the die and the molding, curing the first dielectric layer under a first curing condition, disposing a second dielectric layer over the first dielectric layer, and curing the first dielectric layer and the second dielectric layer under the first curing condition.

Find Patent Forward Citations

Cheng, Hsi-Kuei. (2020). Manufacturing method for semiconductor structure (U.S. Patent No. 10692809). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10692809

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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