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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11901303 B1

PDFFull Text
Date of Patent:
Feb. 13, 2024

Filed:

Jul. 25, 2022

Integrated fan-out package

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Yen Chiu, Hsinchu County, TW;

Ching-Fu Chang, Taipei, TW;

Hsin-Chieh Huang, Hsin-Chu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Patricia D Valenzuela

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 49/02 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 23/522 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/66 (2013.01); H01L 28/10 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5225 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 25/162 (2013.01); H01L 25/50 (2013.01); H01L 27/14618 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/023 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/97 (2013.01);
Abstract

An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an antenna region. The insulating encapsulation encapsulates the integrated circuit. The redistribution circuit structure is disposed on the integrated circuit and the insulating encapsulation. The redistribution circuit structure is electrically connected to the integrated circuit, and the redistribution circuit structure includes a redistribution region and a dummy region including a plurality of dummy patterns embedded therein, wherein the antenna region includes an inductor and a wiring-free dielectric portion, and the wiring-free dielectric portion of the antenna region is between the inductor and the dummy region.

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