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Ming-Yen Chiu

This inventor holds 38 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2025.

USPTO Granted Patents = 38 (Patent Applications = 1)

% Patents Active = 97.4

Average Co-Inventor Count = 2.9

ph-index = 6

Forward Citations = 203(Granted Patents)

Location History:

Hsin-Chu, TW (2012 - 2020)
Zhubei, TW (2015 - 2023)
Hsinchu County, TW (2017 - 2024)

Company Filing History:

38 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2012-2025

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Areas of Expertise:

Integrated Fan-Out

Thermal Dissipation

Conductive Terminals

Wafer Level Packaging

Package Structure

Tilted Interface

Embedded Surface Mount Device

Post-Passivation Interconnect

Dummy Pattern

Scribe Line Metal

Integrated Circuit Alignment

Manufacturing Method

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12334406 - Package with tilted interface between device die and encapsulating material (2025-06-17),

2. 12074066 - Integrated circuit component with conductive terminals of different dimensions and package structure having the same (2024-08-27),

3. 11901303 - Integrated fan-out package (2024-02-13),

4. 11854993 - Integrated fan-out package (2023-12-26),

5. 11804475 - Semiconductor package for thermal dissipation (2023-10-31),

6. 11594520 - Semiconductor package for thermal dissipation (2023-02-28),

7. 11417569 - Package structure having integrated circuit component with conductive terminals of different dimensions (2022-08-16),

8. 11362037 - Integrated fan-out package (2022-06-14),

9. 11322419 - Package with tilted interface between device die and encapsulating material (2022-05-03),

10. 11282796 - Integrated fan-out package and method of fabricating the same (2022-03-22),

11. 10879201 - Semiconductor package for wafer level packaging and manufacturing method thereof (2020-12-29),

12. 10879185 - Package structure with bump (2020-12-29),

13. 10811389 - Semiconductor package for thermal dissipation (2020-10-20),

14. 10790235 - Integrated fan-out package and method of fabricating the same (2020-09-29),

15. 10770402 - Integrated fan-out package (2020-09-08),

Title: The Innovative Journey of Ming-Yen Chiu

Introduction:

Ming-Yen Chiu, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Ming-Yen Chiu's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights:

Throughout his illustrious career, Ming-Yen Chiu has been recognized for his pioneering work in the areas of clean energy and sustainable technologies. His inventions have not only revolutionized the industry but have also had a positive impact on the environment.

Collaborations:

Ming-Yen Chiu has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships have been instrumental in pushing the boundaries of innovation in the field of renewable energy.

Conclusion:

In conclusion, Ming-Yen Chiu's dedication to innovation and his passion for creating a more sustainable future have solidified his position as a trailblazer in the world of technology. His inventive spirit continues to inspire others to push the boundaries of what is possible in the realm of clean energy.

Profile summary based on public USPTO records.

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