The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Oct. 19, 2020
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chen-Hua Yu, Hsinchu, TW;
Shin-Puu Jeng, Hsinchu, TW;
Der-Chyang Yeh, Hsinchu, TW;
Hsien-Wei Chen, Hsinchu, TW;
Cheng-Chieh Hsieh, Tainan, TW;
Ming-Yen Chiu, Zhubei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/065 (2023.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/4853 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 25/105 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/16 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80904 (2013.01); H01L 2224/9202 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using materials that are different than the first external connections in order to provide a thermal pathway from the first package. In a particular embodiment the first external connections are solder balls and the second external connections are copper blocks.