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For the Inventor, By the Inventor

Taipei, Taiwan

Ching-Chung Pai

This inventor holds 3 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2010-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Chung Pai. Retrieved from https://idiyas.com/inventor/ching-chung-pai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:

goldMedal3 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2010-2014

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3 patents (USPTO):Explore Patents
1. 8658483 - Method of fabricating an integrated circuit device having backside bevel protection (2014-02-25),
2. 8338242 - Backside bevel protection (2012-12-25),
3. 7732299 - Process for wafer bonding (2010-06-08),

Title: Inventor Ching-Chung Pai - Revolutionizing Technology in Taipei

Introduction: Ching-Chung Pai is a pioneering inventor hailing from Taipei, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Ching-Chung Pai holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing her diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Ching-Chung Pai has worked with leading tech companies and research institutions, consistently pushing the boundaries of technological advancement.

Collaborations: Throughout her career, Ching-Chung Pai has collaborated with top scientists, engineers, and researchers globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Ching-Chung Pai's relentless pursuit of innovation and her passion for creating technology that positively impacts society solidify her as a trailblazing inventor in the vibrant city of Taipei, Taiwan.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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