The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2014

Filed:

Nov. 19, 2012
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jung-Tzu Hsu, Taoyuan, TW;

Ching-Chung Pai, Taipei, TW;

Yu-Hsien Lin, Hsinchu, TW;

Jyh-Huei Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabricating an integrated circuit device is provided. The method includes forming a replacement gate structure with a dummy polysilicon layer on a first surface of a substrate. The method further includes depositing a dielectric layer by a thermal process to form offset spacers on two opposing sides of the replacement gate structure, wherein the dielectric layer is deposited on the first surface and a second surface opposing the first surface of the substrate. The method further includes removing the dummy polysilicon layer from the replacement gate structure, wherein the dielectric layer on the second surface of the substrate protects the second surface of the substrate during the removing step.


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