Chin-Hsin Peng

Title: Innovations by Chin-Hsin Peng

Introduction

Chin-Hsin Peng is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patents. With a total of 5 patents to his name, Peng continues to push the boundaries of technology in his industry.

Latest Patents

Among his latest patents is the "Dual mode hybrid control and method for CMP slurry." This invention introduces a DMHC (dual mode hybrid control) system that enhances the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The system includes a linear table and a PID (proportional integrated differential) controller connected to a slurry pump, which is crucial for the effective operation of the CMP apparatus.

Another significant patent is the "Automatic sensing wafer blade and method for using." This invention features a wafer blade equipped with a sensor that can self-diagnose potential failure conditions. The blade includes a V-shaped seal ring and a sensor, either a limit switch or a capacitance sensor, to detect the presence of a wafer. This innovation is designed to ensure the reliability and efficiency of wafer handling in semiconductor manufacturing.

Career Highlights

Chin-Hsin Peng is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work has been instrumental in advancing the technology used in semiconductor fabrication. His innovative spirit and technical expertise have earned him recognition in the field.

Collaborations

Peng has collaborated with notable colleagues, including Chien-Ling Huang and Chao-Jung Chang. These partnerships have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Chin-Hsin Peng's contributions to semiconductor technology through his patents demonstrate his commitment to innovation. His work continues to influence the industry and pave the way for future advancements.