The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Oct. 09, 2002
Chao-jung Chang, Yunghe, TW;
Ping-hsu Chen, Taichung, TW;
Chin-hsin Peng, Hsin-Chu, TW;
Jui-cheng Lo, Hsinchu, TW;
Chien-kuo LU, Hsinchu, TW;
Chien-ling Huang, Hsinchu, TW;
Chao-Jung Chang, Yunghe, TW;
Ping-Hsu Chen, Taichung, TW;
Chin-Hsin Peng, Hsin-Chu, TW;
Jui-Cheng Lo, Hsinchu, TW;
Chien-Kuo Lu, Hsinchu, TW;
Chien-Ling Huang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controller operably connected to a slurry pump provided in a slurry flow conduit which delivers the polishing slurry to the CMP apparatus. A bubble trap and a flowmeter provided in the slurry flow conduit downstream of the slurry pump are operably connected to the PID controller, and the CMP apparatus is located downstream of the flowmeter.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile