The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
Sep. 03, 2002
Hsiao-yi LI, Chiai, TW;
Chin-hsin Peng, Hsin-Chu, TW;
Cheng-shun Chan, Tainan, TW;
Jiann-sheng Chang, Hsinchu, TW;
Chung-hao Tseng, Hsinchu, TW;
Chien-ling Huang, Hsinchu, TW;
Hsiao-Yi Li, Chiai, TW;
Chin-Hsin Peng, Hsin-Chu, TW;
Cheng-Shun Chan, Tainan, TW;
Jiann-Sheng Chang, Hsinchu, TW;
Chung-Hao Tseng, Hsinchu, TW;
Chien-Ling Huang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.