Kaohsiung, Taiwan

Chih-Yi Huang

This inventor holds 18 USPTO granted patents and 8 published patent applications. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2010-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Yi Huang. Retrieved from https://idiyas.com/inventor/chih-yi-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2010-2025

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18 patents (USPTO):Explore Patents

Title: Chih-Yi Huang: Innovator in Semiconductor Technology

Introduction

Chih-Yi Huang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 18 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

Among his latest patents is a semiconductor package structure and method for manufacturing the same. This innovation involves a method that includes providing a package body with a first semiconductor device. The first semiconductor device features a plurality of first electrical contacts located adjacent to its active surface. The method also entails measuring the actual positions of these first electrical contacts and providing a plurality of second electrical contacts outside the first semiconductor device. An interconnection structure is then formed based on the actual positions of the first electrical contacts and the positions of the second electrical contacts, ensuring signal integrity during transmission through a mask-less process.

Another notable patent is a package structure and testing method. This package structure comprises a wiring structure, a first electronic device, and a second electronic device. The wiring structure includes at least one dielectric layer and at least one conductive circuit layer in contact with the dielectric layer. The test circuit structure is positioned adjacent to the interconnection portion of the conductive circuit layer. Both electronic devices are electrically connected to the wiring structure, facilitating communication between them through the interconnection portion.

Career Highlights

Chih-Yi Huang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His expertise and contributions have positioned him as a key figure in the industry.

Collaborations

Chih-Yi Huang has collaborated with notable colleagues, including Chen-Chao Wang and Chih-Pin Hung. These partnerships have further enhanced his research and development efforts in semiconductor technology.

Conclusion

Chih-Yi Huang's work in semiconductor technology exemplifies innovation and dedication to advancing the field. His patents reflect a commitment to improving the performance and reliability of semiconductor packages, making a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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