The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Feb. 06, 2017
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Chang-Lin Yeh, Kaohsiung, TW;
Jen-Chieh Kao, Kaohsiung, TW;
Chih-Yi Huang, Kaohsiung, TW;
Fu-Chen Chu, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 43/02 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49838 (2013.01); H01L 43/02 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6677 (2013.01);
Abstract
A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.