The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

May. 01, 2018
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Ian Hu, Kaohsiung, TW;

Ming-Han Wang, Kaohsiung, TW;

Tsun-Lung Hsieh, Kaohsiung, TW;

Chih-Yi Huang, Kaohsiung, TW;

Chih-Pin Hung, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/562 (2013.01); H01L 24/08 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06515 (2013.01);
Abstract

At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate, an interposer disposed on the substrate, a conductive pillar disposed on the substrate, a first semiconductor device disposed on the interposer and electrically connected to the conductive pillar, a second semiconductor device disposed on the interposer, and an encapsulant surrounding the conductive pillar. The first semiconductor device includes a first conductive pad electrically connected to the interposer. The second semiconductor device includes a second conductive pad electrically connected to the interposer.


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