For the Inventor, By the Inventor

Enter inventor name

Hsinchu, Taiwan

Chih-Jung Ni

USPTO Granted Patents = 9

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 11(Granted Patents)

Location History:

Hsinchu, TW (2004 - 2009)
Taichung, TW (2012 - 2024)

Company Filing History:

Winbond Electronics Corporation

Years Active: 2004-2024

Loading Chart...

9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12106964 - Double-patterning method to improve sidewall uniformity (2024-10-01),

2. 12087619 - Semiconductor device and method of fabricating the same (2024-09-10),

3. 11839075 - Semiconductor structure and the forming method thereof (2023-12-05),

4. 11302705 - Semiconductor structure and the forming method thereof (2022-04-12),

5. 8133796 - Method for fabricating shallow trench isolation structures (2012-03-13),

6. 7585754 - Method of forming bonding pad opening (2009-09-08),

7. 6906377 - Flash memory cell and fabrication thereof (2005-06-14),

8. 6852641 - Method of spiking mixed acid liquid in reactor (2005-02-08),

9. 6780780 - Method for removing Si-needles of wafer (2004-08-24),

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…