The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
Jan. 10, 2008
Wen-shun Lo, Hsinchu County, TW;
Chih-jung NI, Hsinchu, TW;
Yi-tung Lin, Taipei County, TW;
Winbond Electronics Corp., Hsinchu, TW;
Abstract
A method of forming a bonding pad opening is provided. A passivation layer and a mask layer are sequentially formed on a substrate having a bonding pad formed thereon. Thereafter, the passivation layer is etched to form an opening with use of an anti-reflection coating (ARC) layer of the bonding pad as an etching stop layer. Next, a dry removal process is performed to remove the mask layer. Afterwards, a wet cleaning process is performed to remove the residual mask layer or a polymer produced by previous manufacturing processes. Thereafter, the ARC layer is removed through performing an etching process with use of the passivation layer as a hard mask layer, so as to form the bonding pad opening.