Company Filing History:
Years Active: 2009
Title: Yi-Tung Lin: Innovator in Bonding Pad Technology
Introduction: Yi-Tung Lin is a notable inventor based in Taipei County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of bonding pad formation. His innovative methods have paved the way for advancements in electronic device manufacturing.
Latest Patents: Yi-Tung Lin holds a patent for a method of forming a bonding pad opening. This method involves the sequential formation of a passivation layer and a mask layer on a substrate with a bonding pad. The process includes etching the passivation layer to create an opening, utilizing an anti-reflection coating layer as an etching stop. Following this, a dry removal process is executed to eliminate the mask layer, succeeded by a wet cleaning process to remove any residual materials. Finally, the anti-reflection coating layer is removed through an etching process, using the passivation layer as a hard mask, resulting in the formation of the bonding pad opening. This patent showcases his expertise and innovative approach in semiconductor manufacturing.
Career Highlights: Yi-Tung Lin is currently employed at Winbond Electronics Corporation, a leading company in the semiconductor industry. His work at Winbond has allowed him to apply his innovative methods in a practical setting, contributing to the company's advancements in technology.
Collaborations: Yi-Tung Lin has collaborated with notable colleagues such as Wen-Shun Lo and Chih-Jung Ni. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion: Yi-Tung Lin's contributions to the field of semiconductor technology, particularly through his patent on bonding pad formation, highlight his role as an influential inventor. His work continues to impact the industry positively, showcasing the importance of innovation in technology development.