Hsinchu, Taiwan

Chih-Hung Cheng

USPTO Granted Patents = 4 

Average Co-Inventor Count = 1.7

ph-index = 2

Forward Citations = 33(Granted Patents)


Location History:

  • Hsinchu County, TW (2009)
  • Hsinchu, TW (2001 - 2018)

Company Filing History:


Years Active: 2001-2018

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4 patents (USPTO):Explore Patents

Title: Chih-Hung Cheng: Innovator in Semiconductor Technology

Introduction

Chih-Hung Cheng is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work has advanced manufacturing processes and product designs in the semiconductor industry.

Latest Patents

Cheng's latest patents include a semiconductor manufacturing process and a package carrier. The package carrier features a light absorption layer that includes a notch at the periphery, allowing light to expose the carrier in a normal direction. This design enhances the efficiency of the semiconductor manufacturing process. Another notable patent is a process for fabricating a micro-display. This process involves several steps, including the formation of a metallic reflective layer on a wafer and the creation of a trench pattern that exposes the wafer's surface.

Career Highlights

Throughout his career, Chih-Hung Cheng has worked with leading companies in the semiconductor industry, including United Microelectronics Corporation and United Semiconductor Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations.

Collaborations

Cheng has collaborated with notable colleagues such as Shih-Hui Wang and Yung-Chi Lin. These partnerships have fostered a creative environment that has led to the development of advanced technologies in semiconductor manufacturing.

Conclusion

Chih-Hung Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor manufacturing processes.

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