Taipei, Taiwan

Chih-Horng Chang

This inventor holds 34 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Horng Chang. Retrieved from https://idiyas.com/inventor/chih-horng-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 

% Patents Active = 85.3

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 79(Granted Patents)


Company Filing History:


Years Active: 2012-2025

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Areas of Expertise:
Conductive Patterns
Thermoelectric Elements
Bump Structure
Surface Treatment
Isolation Rings
Under-Bump Metallization
3D Integrated Circuits
Solder Mask
Fan-Out Structure
Copper Surface Treatment
Thermal Gradient Reflow
34 patents (USPTO):Explore Patents

Title: Innovations by Chih-Horng Chang: Pioneering Patents in Semiconductor Technology

Introduction: Chih-Horng Chang is a prominent inventor based in Taipei, Taiwan, known for his significant contributions to the semiconductor field. With an impressive portfolio of 32 patents, Chang has established himself as a key innovator in modern electronic packaging and integrated circuit designs.

Latest Patents: Among his latest patents, two notable inventions stand out. The first is a “Package structure with conductive patterns in a redistribution layer.” This invention involves an innovative package structure that features an insulating encapsulation, a semiconductor die, and a redistribution circuit structure with intricate conductive patterns, enabling more efficient electronic applications. The second patent, titled “Bump structure having a side recess and semiconductor structure including the same,” relates to an advanced integrated chip structure. This design includes a first substrate with multiple transistor devices and a copper bump with a sidewall defining a recess, enhancing the overall functionality and reliability of semiconductor devices.

Career Highlights: Chih-Horng Chang works at Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leader in semiconductor manufacturing. His expertise in integrated circuits and electronic packaging has not only driven innovation within the company but has also set industry standards for next-generation semiconductor technology.

Collaborations: Throughout his career, Chang has collaborated with esteemed colleagues such as Tin-Hao Kuo and Chen-Shien Chen. Their teamwork has fostered a collaborative environment that prioritizes cutting-edge research and development in semiconductor technology, further propelling the advancements in this vital industry.

Conclusion: Chih-Horng Chang's extensive patent portfolio and collaborative efforts underscore his role as an influential figure in semiconductor technology. His ongoing innovations continue to shape the landscape of electronic packaging and integrated circuits, paving the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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